Bumpless Build Up Layer (BBUL) packaging "grows" the package around the processor rather than manufacturing the processor die separately and bonding it to the package, as is the case with current methods.
Intel said this process will enable faster performance, lower power consumption and smaller processor sizes.
"The development of BBUL technology will allow us to deliver the performance of billion-transistor processors," said Gerald Marcyk, director of Intel's components research laboratory. "It is something today's packaging just cannot handle."
The role of packaging is to house the processor die, supply it with electricity, act as the interface between the silicon and the rest of the computer, and protect it from dirt. It also plays a key role in allowing processing power to grow, as the speed at which it takes data into and out of the silicon can be increased.