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March launch for Intel's Centrino

Intel's Centrino bundle of a chipset, processor and wireless LAN module for portable computers will be released on 12 March.

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Intel's Centrino bundle of a chipset, processor and wireless LAN module for portable computers will be released on 12 March.

The Centrino package is designed for mobility, allowing for the design of smaller notebooks that last longer on a single battery charge. Intel hoped Centrino would boost wireless LAN use. The chip maker now makes its own modules for 802.11b WLAN, a market dominated by WLAN specialists.

The new Pentium-M processor, previously known by the codename Banias, is at the heart of the Centrino package and was designed specifically for portable computers. Earlier Intel notebook processors were, essentially, desktop processors tweaked for mobile use.

Centrino marks the first time Intel has branded a combination of its products. An Intel spokesman said computer makers wanting a Centrino sticker on their hardware would have to buy the whole bundle.

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