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The company, a supplier of products to semiconductor makers, claimed its Endura iCuB/S can deposit barriers and seed layers as thin as a single atom in 65 nanometer semiconductor manufacturing processes.
The Endura iCuB/S should allow semiconductor makers to place up to 20 times more transistors on a chip, Applied Materials said.
Most of today's semiconductor makers, such as Intel and AMD, have just adopted 130 nanometer, or .13 micron, production and will move to 90 nanometer before 65 nanometer.