Infineon and Huawei collaborate on 3G broadband mobile phone

German chip maker Infineon Technologies and Chinese network equipment vendor Huawei Technologies are to develop a low-cost...

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German chip maker Infineon Technologies and Chinese network equipment vendor Huawei Technologies are to develop a low-cost platform together for third-generation broadband mobile phones targeting the Chinese market.

Infineon will contribute the reference design and protocol stack software for the phone platform, based on the WCDMA (Wideband Code Division Multiplex Access) standard, while Huawei will provide network technology and terminal testing.

The companies provided no financial or product availability details.

Last month, Huawei struck an agreement with Siemens, which spun out Infineon a few years ago, to form a $100m venture to manufacture 3G mobile phones, based on the Time Division-Synchronous Code Division Multiple Access technology.

John Blau writes for IDG News Service

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