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The technique, developed by the German chip maker, runs packaging film through several coating and surfacing phases at high speed, with the active and most sensitive layer of the thin-film transistor applied as the last layer.
Applications for the integrated plastic chips include flexible radio frequency identification tags, which could replace barcodes one day.
Infineon predicted there would be demand for more than 500 billion tags a year if every newly produced item carried one.
The company said semiconductor companies, for instance, could manufacture plastic chips that retailers and other companies could glue as labels to packaged goods, or supply packaging film with integrated electronic components for further processing.