IBM jointly develops low power chips

IBM, Infineon Technologies, Samsung Electronics and Chartered Semiconductor Manufacturing have jointly developed 45nm chip-making technology to deliver low power processing in devices.

IBM, Infineon Technologies, Samsung Electronics and Chartered Semiconductor Manufacturing have jointly developed 45nm chip-making technology to deliver low power processing in devices.

The first working circuits in 45nm technology, targeted at next-generation communication systems, were developed jointly by the partners at an IBM fabrication line in New York.

The 45nm process is a step up from the 65nm process used for higher-end chips on the market, and allows users to gain lower power processing at increased speeds.

The companies involved see the new chip-making process as an ideal way to address the needs of next-generation mobile devices.

The 45nm chip-making process is expected to be installed at Chartered, IBM and Samsung labs by the end of 2007.

Intel and AMD have already demonstrated 45nm chips and are expected to launch them on the market first.

 


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