The three companies have successfully produced test 1Mbit and 4Mbit SRAM (static RAM) chips on 8in wafers at the joint ST-Philips pilot production line in Crolles, France, and at TSMC's Fab 3 research and development facility in Hsinchu, Taiwan, the companies said. Prototype chip production using the 0.09 micron process is expected to begin during the second half of 2002.
The 0.09 micron process will allow the three companies to produce chips that run at higher speeds and consume less power than chips produced using an existing 0.13 micron process. The 0.09 micron process is expected to be used to produce chips for a range of applications, including 3G mobile handsets and digital consumer products, the companies said.
The development of the 0.09 micron process is part of joint development project between the three companies to develop advanced chip-making processes. The project began in mid-2001 and will last five years, said Renee Penning de Vries, deputy chief technology officer at Philips Semiconductors.
Among the reasons for the three companies coming together to jointly develop advanced production processes were the need to develop alternative production capacity, a desire to share high research and development costs, and a need to stay ahead of competitors by bringing volume 0.09 micron production online as quickly as possible, said Jack Sun, senior director at TSMC's Advanced Logic Technology Division.
Looking ahead, the companies plan to develop more advanced processes, including a 0.065 micron process that is expected to be introduced roughly two years after the 0.09 micron process, Sun said.
Reaching that goal won't be easy, however. Chip makers are concerned about how much the 0.065 micron process will cost to develop and whether the equipment needed to make semiconductors using a 0.065 micron process will be available in two years' time, Sun said.
There are also significant technical hurdles that must be overcome in the development of the 0.065 micron process, said Penning de Vries.