Texas and AMD cross lines to work together on 3G

Texas Instruments (TI) and Advanced Micro Devices (AMD) are collaborating on a third-generation (3G) mobile architecture that...

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Texas Instruments (TI) and Advanced Micro Devices (AMD) are collaborating on a third-generation (3G) mobile architecture that they claim will make it easier to develop mobile devices using Bluetooth and other add-ons, writes Daniel Thomas

Mobile technology is poised for rapid development over the next two or three years. Mobile phones will become high-speed Internet and entertainment terminals and wireless providers will rush to buy 3G spectrum licences to capitalise on the predicted growth in mobile commerce.

These advances will mean that high technology will have to be compressed into small devices, and TI and AMD believe their mobile platform, which incorporates TI's processors and AMD's flash memory, will be attract developers' attention.

Walid Maghribi, vice-president of AMD's Memory Group, said, "The collaboration of TI and AMD, to address the requirements of the wireless market, will result in the development of innovative technology standards to enable the proliferation of high-performance mobile terminals."

The architecture will use TI's Open Multimedia Application Platform processors, based on digital signal processors and AMD's Flash memory products which are also used by developers such as Fujitsu-Siemens.

TI says that by using this package, more space will be made available for new technologies such as Bluetooth and global positioning systems.

At the same time, TI added, grouping the different components in one package will reduce power consumption, which always at a premium for portable devices.



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