Intel is to build its first
wafer fab in Asia, with a $2.5bn (£1.31bn) investment in
China.
The 300mm wafer fabrication facility in the coastal Northeast
China city of Dalian will be known as Fab 68.
“China is our fastest-growing major market and we believe it’s
critical that we invest in markets that will provide for future
growth to better serve our customers,” said Intel CEO Paul
Otellini.
Not since 1992, with the construction of Fab 10 in Ireland, has
Intel built a fab from the ground up at a brand new site.
Construction on Fab 68 is scheduled to begin later this year
with production projected to begin in the first half of 2010.
Initial production will be dedicated to chipsets to support Intel’s
core microprocessor business.
“The project will have a positive impact to the regional
economic development and the development of integrated circuits
industry in the old industrial base of northeast China,” said Zhang
Xiaoqiang, vice-chairman of China’s National Development and Reform
Commission.
Manufacturing with 300mm wafers dramatically increases the
ability to produce semiconductors at a lower cost compared with
more commonly used 200mm (8inch) wafers.
The bigger wafers lower production cost per chip while
diminishing overall use of resources. Using 300mm manufacturing
technology consumes 40% less energy and water per chip than a 200mm
wafer factory, said Intel.
Related article:
Intel invests in faster 45nm processors
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