Trio form chip R&D alliance

Motorola, Koninklijke Philips Electronics and STMicroelectronics have signed an agreement to collaborate on the development of...

Motorola, Koninklijke Philips Electronics and STMicroelectronics have signed an agreement to collaborate on the development of advanced chip-making technology.

The announcement expands on an agreement announced last month between ST, Philips and the world's largest contract chipmaker, Taiwan Semiconductor Manufacturing to develop process technology for making chips.

Working with TSMC, the three chip makers will focus their joint research and development efforts on developing future process technology from 0.09 microns (90 nanometers) down to 0.032 microns over the next five years, they said in a joint statement.

The joint development program will be based in France, at the "Crolles 2" research and development centre, which includes a 300mm wafer fabrication line, established by ST and Philips.

Motorola, Philips and ST will share equally the cost of capital expenditure, R&D and wafer loads at the Crolles 2 facility, the statement said.

The three companies are expected to invest a total of $1.4bn (£975m) in the joint R&D project by 2005.

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